Application Profiles
Semiconductor Fabrication Facilities
Semiconductor Fabrication Facilities
Accelerating Design-Build Schedules with Precast
Combining Tindall’s professional engineering expertise with the advantages of precast, prestressed concrete framing systems results in ideal solutions for the semiconductor market. From a long-spanning roof over the clean room to shortened design-build schedules, Tindall has the experience to track parallel development of the structure and process.
Combining Tindall’s professional engineering expertise with the advantages of precast, prestressed concrete framing systems results in ideal solutions for the semiconductor market. From a long-spanning roof over the clean room to shortened design-build schedules, Tindall has the experience to track parallel development of the structure and process.
Projects
Design Features
Structural Elements
Functional Characteristics
IBM B/323 Fabrication Plant
Fishkill, NY
Highlights: 270,000-sq. ft. of elevated precast erected in less than 3 months
Motorola-Siemens WhiteOak Semiconductor Plant I
Sandston, VA
Highlights: 130-ft clear span roof over clean room; 10 weeks to erect entire structure
Infineon WhiteOak Semiconductor Plant II
Sandston, VA
Highlights: Cast-in-place waffle slab floor was constructed after the precast was erected to increase overall speed of construction
Fishkill, NY
Highlights: 270,000-sq. ft. of elevated precast erected in less than 3 months
Motorola-Siemens WhiteOak Semiconductor Plant I
Sandston, VA
Highlights: 130-ft clear span roof over clean room; 10 weeks to erect entire structure
Infineon WhiteOak Semiconductor Plant II
Sandston, VA
Highlights: Cast-in-place waffle slab floor was constructed after the precast was erected to increase overall speed of construction
- Fast erection schedules
- Paint-ready surfaces in environmentally and air controlled areas
- Cast-in connections for electrical, mechanical and plumbing
- Lower initial building and operating costs than cast-in-place
- Part of record-setting project for Motorola-Siemens (VA), erecting 1,000 precast pieces in just 10 weeks (See project’s short-turn progress in slideshow)
- Manage 100-plus-ft spans and loads up to 250 psf with 12-ft-wide, 5-ft-deep double tees
- Accommodate tight deflection criteria for roofs over clean rooms with long span structural members that have ¾ in. or less deflection
- Lateral loads resisted by either frames, infill walls or combination as dictated by process requirements
- Easily add or change out equipment with long, free spans and high headroom
- Handle high temperatures involved in fabricating wafers without deterioration
- Control vibration by placing and grouting double tee ends into support beam pockets and anchoring equipment to precast elements